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[2015-03-24]   Gold plated pcb (immersion gold circuit board) which is suitable for the solder joint temperature?
[2015-03-22]   What is purpose and principles for OSP? And what are the advantages and disadvantages?
[2015-03-20]   Via conduction holes in the circuit board BGA area, pore side have redness, suspected exposed copper phenomenon, what is the reason?
[2015-03-18]   Is there a allowable standards for peeling-off solder ink of chips area in the international norm?
[2015-03-17]   Circuit board surface treatement in the via hole are covered by solder mask is too high, it will cause a short circuit caused by SMT, whether it has a standard or specifications?
[2015-03-15]   In the PCB process, why should exposure and development?
[2015-03-15]   How to remedy about solder mask ink rework and a series of problems which appears in pcb solder mask ink in PCB factory shipment?
[2015-03-13]   Circuit board printing ink resistance of copper on the PCB ,1mil thickness the voltage is 2000VDC / mil
[2015-03-11]   What's the reason for solder mask ink peeling after pcb immersion gold?
[2015-03-10]   Circuit board process, how to fill full for the resin filling holes, and without bubbles?
[2015-03-09]   What does mean for pseudo exposed copper on circuit board?
[2015-03-05]   How much is the actual thickness of PCB solder mask oil? How to do 1mil? How to measure?


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