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| Via conduction holes in the circuit board BGA area, pore side have redness, suspected exposed copper phenomenon, what is the reason? |
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Question should be referred to the assembly with BGA motherboard (main board), rather than the package carrier plate (SUBSTRATE ) due to the two different surface treatment, the former mostly exposed copper HASL, after all, mostly is nickel gold.
If it is motherboard, then it will be do HASL for green soldermask, green soldermask empty outline printed in PTH grommet (Annular ring) surface, the thickness will usually thinner, because the ink flows into the drain hole exigencies. See it through the solder mask of copper in the end, it will appear red. If you do not break the little ball is not wetting their impact. operator or mechanical operation, or slow down the blade feed rate or increase the ink viscosity, increasing the thickness of wet film can be improved.
For reprint, please also specify from www.pcba.co |
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