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| Circuit board process, how to fill full for the resin filling holes, and without bubbles? |
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PCB circuit board manufacturing process, the basic condition for good hole fill is that no agent of the ink container, vacuum mixing, thick blade, slow the printing speed. Mesh or steel are possible, but there must be a sufficient amount of ink squeegee complete specific product of different parameters vary. must attempt,this is only for reference .
For reprint, please also specify from www.pcba.co |
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