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| Your Location£ºHome > News > PCBA-FAQ |
| Is there a allowable standards for peeling-off solder ink of chips area in the international norm? |
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the so-called chips solder dam refer to BGA or QFP between other large IC components soldered pin, to prevent short-circuiting of solder paste soldering and it need to be added solder bridge, (the general said is whether the IC pins need to keep solder bridges). Since the exposure and development is often caused by lack of width of the root, so that the adhesion also will be weakened. this is no special provisions, generally according to IPC-6012 3.8.2 to carry out inspection and acceptance.
But customers also have many other requirements, such as non-green solder mask between the two PADs, welding foot need to be covered solder paste when doing SMT assembly, and then put the parts, and the parts can be carried out after welding foot positioned on the solder paste. Once the pin and the pad is too close and placed deviation errors, inevitably will result in quality or reliability problems, when its pitch (in the distance) less than 12.5mil,the effect is more obvious, so it is best to use solde dam (solder bridge) to prevent quality problems related to short circuit.
For reprint, please also specify from www.pcba.co |
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