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| What is purpose and principles for OSP? And what are the advantages and disadvantages? |
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OSP (Organic solderaitity preservative), OSP refers to a variety of bare copper solderability preservative welding surface of the early single panel to reduce weldability treatment layer costs, change in bare copper solder layer coated with a protective layer of oily film, called "to weld preflux". Because the oil film of sticky hands and hinder the electrical test, but preflux never use in double-sided and multilayer industry too.
Japanese industry developed a imidazo-containing aqueous to the flux in the bare copper surface of the transparent protective film .It is better to protect these copper solderability preservative properties, can withstand repeated heating for SMT assembly, have been used in double-sided and multi-layer PCB board,it is called OSP, it can be appropriate to replace HASL and Immersion Gold pcb manufacturing process.
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