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| What's the reason for solder mask ink peeling after pcb immersion gold? |
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Basically there are several possibilities for S / M Peeling,
the first may be the pre-treatment of the copper surface is not ideal, and the second may be S / M ink dry inadequate before exposing,the third may be stalled for too long to produce an oxide layer, and the fourth may be green oil is not suitable for the material itself and not suitable for chemical gold process, the fifth may be green oil has insufficient degree of polymerization,
the sixth is if you did more than once high temperature process, for example: chemical gold and gold-plated gold together or twice immersion gold, S/M peeling may also occur.
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