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[2015-04-22]   What is the reason of oxidation for pcb immersion gold?
[2015-04-22]   PCB manufacturing process, after solder mask is HAL.What is the purpose for HAL?
[2015-04-08]   What's the reason of Ni/Cu exposure on pcb gold-plated surface?
[2015-04-07]   How to prevent the precipitation of copper oxide of PCB Goldfinger?
[2015-04-03]   What's the English name of 硬金和软金? What is the difference in characteristics for soft gold plating and immersion gold?
[2015-04-02]   How to remove water marks on PCB finger?
[2015-03-31]   WEEE required by lead-free operation, referring to the material (solder, parts feet)connection, and SMT operation, reflow process, completely lead-free? Or will be much less than the allowable lead content?
[2015-03-30]   How to overcome PCB Gold finger oxidation ?
[2015-03-30]   What's the comparison and merits of HAL, OSP, and immersion gold,immersion silver and other manufacturing process?
[2015-03-26]   What's the anti-oxygenation treatment-sealing treatment after plug goldfinger gold plating process?
[2015-03-25]   How to improve the soldering balls on pcb?
[2015-03-25]    what the drawbacks include of PCB goldfinger ?


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