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| What's the comparison and merits of HAL, OSP, and immersion gold,immersion silver and other manufacturing process? |
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These above mentioned processes are pcb final metal treatment process, there is a little complex for comparing with them , now the obvious differences are HAL price low but the flatness is insufficient, and the future of unleaded demand may not be met.
OSP also belong to low-cost treatment process, but it is not easy to control the thickness of the detection, and, when the choice of flux SMT assembly are more critical. Therefore, universality is not so high. Chemical gold is a more common type of application species, but production costs are more expensive, and sometimes welding quality has been questioned because of the quality of the nickel surface is difficult to control.
Chemical silver is another metal treatment has recently been introduced, since the surface of chemical silver last surface treatment must still be coated with a thin layer of OSP, it will have similar problems with osp.
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