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PCB processes are the same with other processes, only the surface treatment process are not the same: HASL and ENIG, so is any difference for the circuit signal?And how to measure its thickness for immersion gold?
    In terms of general electrical signal is not the significantly different, mainly because of different assembly ways for HASL And Immersion Gold Board. In fact, its parts are solder contacts, so little should be different, some high-end communication board in order to avoid noise , no need to solder directly assembled terminal pressed into the pattern. In general welding assembly board was not significantly different, immersion gold and gold plated the main application is divided into plug and welding two kinds.
     Thick gold measurement equipment, mainly is X-RAY measurement .Generally measure the nickel thickness is150-200 micro inches, gold thickness is 2-3 micro-inches, specific will according to  customers requirements.
         For reprint, please indicate by www.pcba.co
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