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| Your Location£ºHome > News > PCBA-FAQ |
| What is difference for HAL, OSP and immersion gold? |
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These processes are the final metal surface treatment for circuit boards . The difference is obvious that the HAL cost is lower, but it lack of smoothness, and because of environmental requirements, it has asked to do HASL process .OSP is a low cost process, but the thickness is not easy to test control and a subsequent assembly of flux is also required. However, after the introduction of a new generation formulation can withstand reflow operation for many times, so there are still a considerable proportion of this type for application. Immersion gold process is common, but high production costs, and a welding quality has been questioned, especially nicke on the surface that quality is difficult to control, but because this process does not require extra wire design, while the gold does not produce oxidized in the air, so there are some key design requirements of products what away use this surface treatment.
And industry also push out immersion tin, immersion silver and gold-plated this surface treatment process, but it aslo according to the demand for different products. Faced with a growing number of assembly demand, the hybrid surface treatment will become the electronic industry generally expected, but it has to face no perfect single process. It also needs to understand for customers. |
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