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| Before the Assembly, how to remove moisture for Rigid-Flex board ? |
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The PCB storage space is as good climate control in the early, or even the best procedures and conditions dehumidifier will come to naught. Prebaked prior to assembly is no absolute standard, before packing the finished product into the plant status or FPC standing in the air for a time ,it will Effect FPC residual moisture content.
The purpose of baking is to dehumidify ,so it must be compatible with the actual situation of judgment. In general, FPC moisture absorption rate is slightly higher, so the baking it must be according to the physical properties and experience to ajust the bake drying conditions. If it allowed to stand before assembly, it is necessary to confirm the environment and the time, if the time more over four hours, it is recommended to bake again.In general baking temperature can be maintained at about 130 degrees, below 105 degrees the baking it can be ineffective , if the temperature over 140 degrees glue binding is easy to embrittlement. |
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