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| 3D printed circuit board has birth of a new patent , It can catch traditional PCB manufacturing |
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On March 28, 2016, 3D printed electronics industry of well-known enterprises Nano Dimension announced that its wholly-owned subsidiary of Nano Dimension Technologies Division has filed a patent application with the US Patent and Trademark Office, the patent application relates to technology that a printed circuit board (PCB) on the printed shield wire method.
Nano Dimension has developed a unique 3D printing method, this method can create a 3D print of the protective layer to shield conductors, like as an insulated cable, and the new 3D printing technology can be ported to a printed circuit board.
This innovative approach to minimize the use of high-speed communication in the field of printed circuit board dimensions to create opportunities.
By selectively depositing the nanosized conductive ink, the manufacturer can minimize the distance along the entire length of the wire to generate a shield ,so that it can prevent leakage and loss. This is similar way to the use of shielded cables on outside of printed circuit. 3D printing technology achieve that the shielded cable inside (printed circuit board)
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