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| Your Location£ºHome > News > PCBA-FAQ |
| How to design pcb pads to achieve the best strength based on different bonding wire (AU OR AL)? |
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Wire areas are generally clean and smooth as long as there are suitable metal surface treatment, you should can get a good wire strength, which differences are aluminum and gold wire operating at different temperatures, so choose the substrate material is not necessarily the same, Bonding Au wire substrate high temperature resistant materials must be used.
As PAD design, usually the bonding wire size is more than three times wire diameter at least, because pressing thread onto PAD must have sufficient surface deformation, in order to produce sufficient binding force plus the amount of deviation of the position, and the other includes pcb top bottom pad width difference.
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