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| PCB bonding (wire bonding), whether can be the use immersion gold or soft gold as PAD, whether can be use hard gold? |
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Bonding wire gold layer generally can be used solf gold, immersion gold and gold plated theoretically can be used, However, there must have enough thickness, because different operating conditions in different wire and substrate, there are differences in the minimum plating thickness desired. because hard gold containing more impurities, so the wire bonding operation can not be abundant form so hard gold wire does not apply, according to professional sources, in fact, binding wire is a combination of forces due to the underlying gold and nickel composition. so if gold is hard, I am afraid that with the gold wire also Unable penetration through the gold layer, so in theory the hard gold is not suitable for playing wire bonding.
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