For now process technology, as long as remove spray tin and tin lead plating process, switch to other final metal processing technology, it has been able to achieve lead-free requirements, so it can be said that it has mature manufacturer process and nothing special.

However, when pcb is finished, pcb assembly need to achieve the lead-free requirements, precautions thus generated, the circuit board material temperature resistance could be part of the more need to pay attention.

Because the lead-free solder in the future, most recipes will increase the operating temperature .in the circuit board manufacturing, lead-free issue is not very large, the only major problem is not the use of lead-free metal surface treatment. Certain metals treatment process  is expensive than HAL , there no problem in teachnolgy.
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