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| What factors are related for poor PCB soldering, and what is related with PCB surface treatment? |
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Unhealthy eating tin for many reasons, but the main problem is surface unclean or surfactants insufficient when sodering. Basic conditions maintained on the tin, is to have a clean surface, compatible with the tin metal surface treatment, appropriate metal composed of four parts good flux.
Cleaned surface that some organics or other contaminants should not occur, even if the flux occurs should be cleared away. Metal surface treatment compatible, it is to provide the solder can landing environment, such as OSP , HASL, immersion gold, gold plated and so on. proper composition of the metal, mainly refers to the type of PCB with HAL, because of HAL job there is variation in metal content issues, which include Cu, tin, Pb and other elements,if Cu content is high , it is a problem of high melting point.
Good flux terms, it can make the metal surface activation, and smooth tin smoothing. Since general metal exposed to the air, it can produce an oxide, if thin oxide can not removed, welding activity not easy to produce. Therefore flux provided this functionality.
In general, the best weldability metal processing still spray tin board the best, because of the same metal. As gold soldering is also good,it is better than nickel, nickel-poor because nickel oxide in aire is quickly. oxide layer is not easy to remove, otherwise adhesion of nickel is not bad, gilt iron sheet aimed at multiple, sometimes for soldering, sometimes for operational, Sometimes in order to facilitate insertion. However, oxidation prevention function is very important.
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