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| What's difference between ENIG pcb and gold plated pcb? which one is not easy to oxidation? and which one does have a good solderability? |
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Actually there is no significant difference for their excess solder if the coverage rate of solder mask is good,Generally speaking,their oxidation is almost the same if they have the same board thickness.
The biggest difference between these two surface treatments is their applications. gold plating process is easy to build up the pcb thickness because of its fast processing speed, so it has mostly been applied to wire bonding type area.but ENIG process is mostly used in soldering or wedge bonding.
Another one is oxidation problem,in fact,gold wont natural oxidation in air,its cover area occurs exposed tins of microvoid,that caused the surface colors change because of the bottom tins oxidation.
On the other hand of excess solder,due to gold content of tin alloy more than 1%,so its very brittle,therefore mostly for metal surface soldering.thinner gold is still be commonly used.
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