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How to deal with this which will not have the phenomenon of skip printing and shadow when coating solder mask on thick copper boards?
      For the pcb printing with bigger thickness difference,if completely filled it, there are two things must be noted,the first is the liquidity,the second is the ink supply.
      So some foreign companies have used a similar approach to filling the part of gap by adding more prepregs in pcb,and then printing after solder mask coating,this approach can be considered.
      Alternatively,you can consider multi-printing methods,dont monological think the printing can be finished once.

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