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| Your Location£ºHome > News > PCBA-FAQ |
| Whether pcb boards SMD pad size will be different based on the different welding processes? How to set PAD size? |
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There is no absolute answer to this question,it is generally based on the circuit density to create the contact PAD size moderately,
At assembly, if it can be provided moderate amount of tin, Components can be welded firmly and do not fall,that is a good design,
but if its a improper design or bonding force is not enough or over an area of design, it have to be supplied more tin,
therefore prone to the same piece of stencil printing cause insufficient amount of tin, it is not a good design, so it is necessary discretion.
For reprint, please indicate by www.pcba.co
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