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| Your Location£ºHome > News > PCBA-FAQ |
| Is there any experience to provide for BGA and CSP assembly process yield can not be significantly improved? |
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As a rule of thumb,the following for your reference:
A: Parts must be baked again, because sometimes the vacuum bag drying degree is not ideal.
B: Parts will be stored in a dry box to keep dryness in manufacturing process.
C: Printing the fixing sheet and wiping steel plate.
D: As AOI for full inspection, confirm the quality status, and so on.
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