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| Your Location£ºHome > News > PCBA-FAQ |
| How to remove the the stream of moisture in RIGID-FLEX board (FPC)? |
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You must first understand the board storage space must have climate control, otherwise no matter how good the dehumidification program and conditions will come to naught,the following description for your reference:
A.The baking temperature should be about 250 degrees F (about 130 degrees C); it doesnt work well if lower than 220 degrees F, and rubber is easy becoming brittle (embrittle) if higher than 270 degrees F.
B.Acrylic adhesive is more easier to absorb moisture than the PI and EPOXY.
C.Standard single sided and double sided FPC BAKING conditions: 10-20 minutes, 0.05 inches thick multilayer fpc within 1-2 hours .RIGID-FLEX is 4-12 hours,to adjustment depending on the thickness.
The conditions described above,each company needs to find the best conditions according to own process parameters, Pay particular attention to be assembled immediately after baking, or else need to be placed in drying oven.
For reprint, please indicate by www.pcba.co
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