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Is pcb bow and twist caused by wrong longitude and latitude or both sides of the copper surface after etching caused uneven stress formed?
    There are many reasons for stress uneven, asymmetry is the main reason. This includes an asymmetrical structure,
Asymmetric polymerization degree, of course, there may be excessive dimensional change differences,
so the good suggestion is pay more attention on cutting material latitude and longitude for the inner layer of the multilayer circuit board. another need to strengthen baking,and doing decompression considerations for lamination conditions when laminating,
   So perhaps its very helpful for pcb bow and twist problems.
   both sides of the copper surface after etching caused uneven stress ,the circuit design cant be changed in pcb design under the circumstances,
   You can add fake copper foil in the non-active area (Dummy Pad). we can see improvements for reference only.

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