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| What is the reason for pcb substrate board warpage (warpage) caused that? What is the impact on SMT and assembly process? And what is IPC standards and industry standards? |
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The reason for the substrate warpage caused by residual stress, such as thermal residual stress, mechanical residual stress, etc. laminate process is the major causes at present research, because there are so many causes which is unable to list all,
so we suggest that you apply for all remaining possible manufacturing process to improve, it is possible to reduce warpage.
the main problem is coplanarity for the impact of smt and assembly process. Prone to cause cold welding and poor alignment problems when doing smt and backward welding if it has bad coplanar.
For IPC standards, general pcb manufacturers do not fully comply with common specifications for each inch board warpage 2mil. But for semiconductor encapsulation substrate generally have more stringent specifications, every inch is often required 1mil, these specifications for thicker pcb substrate board is meaningful.
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