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| What's causing pcb thick copper plating blistering and bullet holes (after second copper plating)? |
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The basic reason of the thick copper bubble is copper layer internal pressure greater than adhesion,its not easy to completely avoid, relatively simple workaround is to strengthen CCL copper surfaces clean pretreatment.
Bullet hole is edge lower secondary line (upright board dash) occurred at the graph of depression, because the tiny bubble attached (probably from blowing, a small part of the hydrogen) lead to copper cant be plated, try to avoid bubbles floating over to PCB surface from top-down,The pcb level of copper plating can be avoide.
For reprint, please indicate by www.pcba.co
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