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What is the reason for multi-layer circuit board after pressing substrate thickness deviation ?
      Reasons: usually the relationship between the substrate voltage confluence gum, often the possibility of the central thick and the thin plate edge, But the average thickness it still need to be in specification.
    Often due to the film thickness is away from high traffic gum (Resin Flow), such that large pressure timely flow of plastic rubber content (Resin Contain) reduced, resulting in the formation of the phenomenon of low thickness. Further combinations of film thickness also a considerable degree of influences.
     Measures: low thickness it due to plastic flow caused by too much , it can adjuste via the glue film production conditions and the PCB lamination operation cycle. As a result of a combination of thickness deviation from improper, it can need the experience and experiment to be amended.

        For reprint, please indicate by www.pcba.co
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