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| What is the pcb substrate copper foil reverse? What is the difference with normal pcb substrate? |
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Conventional electroplating copper surface having the two parts that is shiny side and roughened surface, in the general use of the board will be connected roughened copper surface and resin, to produce tension. However, since the roughness of the roughened surface is deep, if we made it on the surface of the roughened surface of the circuit board, this homogeneous rough surface may be attached dry film directly in the future, do not have too much pre-treatment can reach a good combination force. Thus, circuit board substrate suppliers try to reverse the rough copper surface, and the smooth surface will be made additional strengthening binding processes, such usage is called inverted copper foil usage. Also, because the smooth surface roughness is very low, and therefore its easier to etch clean when making the thin lines, and therefore its good to thin lines production and improve yield. Most manufacturers also have started doing such applications.
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